Power of the module
Dedicated factorized power solutions for computing
Dedicated factorized power solutions for computing
The Data Center PRM & VTM solutions leverage the value of Factorized Power Architecture™ in demanding, non-isolated server applications providing 48V Direct to POL power conversion for CPU, GPU, ASIC, and memory loads. These solutions provide high density, high efficiency, and low noise conversion for high performance computing.
Features and Benefits
PRM features and benefits
Non-isolated, regulator
ZVS buck-boost topology
~1MHz switching frequency
Power density up to 1,700W/in3 (103W/cm3)
Features and Benefits
VTM features and benefits
Non-isolated, voltage transformer
Up to 135A
High-frequency Sine Amplitude Converter™
Fast transient response
Select a PRM
0 Products
| Input Range (V) | Type | Output Range (V) | Power | Package | Add to cart / view details | ||
|---|---|---|---|---|---|---|---|
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Input Range (V): 38 – 60 | Type: VTM Compatible PRM | Output Range (V): 38 – 50 | Power: 200 | Package: 10 x 14 x 2.5 mm (LGA SiP) | Details | |
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Input Range (V): 38 – 60 | Type: VTM Compatible PRM | Output Range (V): 38 – 50 | Power: 240 | Package: 10 x 14 x 2.5 mm (LGA SiP) | Details | |
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Input Range (V): 38 – 60 | Type: VTM Compatible PRM | Output Range (V): 28 – 60 | Power: 200 | Package: 10 x 10 x 2.5 mm (LGA SiP) | Details | |
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Input Range (V): 38 – 60 | Type: VTM Compatible PRM | Output Range (V): 24 – 60 | Power: 360 | Package: 10 x 14 x 2.5 mm (LGA SiP) | Details | |
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Input Range (V): 38 – 60 | Type: VTM Compatible PRM | Output Range (V): 28 – 54 | Power: 100 | Package: 10 x 10 x 2.5 mm (LGA SiP) | Details | |
Select a VTM
0 Products
| Vin (V) | Vout (V) | Output Current (A) | Package | Add to cart / view details | ||
|---|---|---|---|---|---|---|
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Vin (V): 48 (0 - 55) | Vout (V): 2.0 (0 - 2.3) | Output Current (A): 88 | Package: 1323 ChiP | Details | |
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Vin (V): 48 (0 - 60) | Vout (V): 1.0 (0 - 1.25) | Output Current (A): 107 | Package: 1323 ChiP | Details | |
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Vin (V): 48 (0 - 55) | Vout (V): 2.0 (0 - 2.3) | Output Current (A): 95 | Package: 1323 ChiP | Details | |
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Vin (V): 40 (0 - 60) | Vout (V): 1.0 (0 - 1.5) | Output Current (A): 130 | Package: 1323 ChiP | Details | |
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Vin (V): 48 (0 - 60) | Vout (V): 1.0 (0 - 1.25) | Output Current (A): 135 | Package: 1323 ChiP | Details | |
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Vin (V): 48 (0 - 52) | Vout (V): 1.2 (0 - 1.63) | Output Current (A): 76 | Package: 0823 ChiP | Details | |
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Vin (V): 48 (0 - 60) | Vout (V): 1.2 (0 - 1.25) | Output Current (A): 105 | Package: 0823 ChiP | Details | |
and
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Output specifications:
Output
Resources
Resources for the design engineer
- AN:005 – FPA Printed Circuit Board Layout Guidelines
- AN:017 – RoHS-Compliant Through-Hole VI Chip Soldering Recommendations
- AN:031 – Through-Hole ChiP Package Soldering Guidelines
- AN:032 – Designing High Power Parallel Arrays with PRMs
- AN:033 – Fault Management Circuit
- AN:034 – Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters
- UG:013 – VI Chip Configurable PRM® Module Evaluation Board Users Guide
- UG:014 - VI Chip VTM® Evaluation Board User Guide
- UG:016 – VI Chip PRM®Remote Sense Evaluation Board User Guide
- For use with PCB part numbers 38693 and 39573
- Datacenter Power Delivery Architectures: Efficency and Annual Operating Costs
- 48 is the New 12 : Server Power in the Rapidly Growing Digital Universe
- FPA Overview: An Introduction to FPA
- Enabling Next Generation High-Density Power Conversion
- High Current, Low Voltage Solution for Microprocessor Applications from 48 V Input
- Efficient Power Conversion Solutions
- Dual-Stage Feedback Technique for Single-Pole Feedback Compensation
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